2022-11-18
The behavior of silicon-induced corrosion of 6063 aluminum alloy profiles can be completely prevented and controlled. As long as the purchase of raw materials and alloy composition are effectively controlled, the ratio of magnesium and silicon is guaranteed to be within the range of 1.3 to 1.7, and the parameters of each process (such as melting , stirring, casting cooling water temperature, bar preheating temperature, extrusion quenching air cooling strength, aging temperature and time, etc.) are strictly controlled to avoid segregation and freeing of silicon, and try to make silicon and magnesium form a beneficial Mg2Si strengthening phase.
If this phenomenon of silicon corrosion points is found, special attention should be paid to the surface treatment. In the process of degreasing, try to use weak alkaline bath solution. If conditions do not allow, it should also be soaked in acid degreasing solution for the time Try to shorten it as much as possible (qualified aluminum alloy profiles can be placed in acid degreasing solution for 20-30 minutes without problems, while problematic profiles can only be placed on the surface for 1-3 minutes), and the pH value of subsequent washing water should be higher (pH>4, control Cl-content), prolong the corrosion time as much as possible in the process of alkali corrosion, use nitric acid light-extracting liquid when neutralizing light, and electrify oxidation treatment as soon as possible in sulfuric acid anodic oxidation, so that the dark gray corrosion point caused by silicon is not obvious. , which can meet the usage requirements.
Although silicon is an indispensable main component in 6063 aluminum alloy profiles, if the amount of added silicon is not appropriate, the added silicon does not completely form a Mg2Si strengthening phase with magnesium, resulting in the segregation and freeing of silicon, which will be easily caused by silicon in the surface treatment process. Corrosion phenomenon of aluminum alloy profiles. In production, the main alloy components, impurities and process parameters must be strictly controlled to prevent such phenomena from occurring.
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